Effect of electrolyte pH and Cu concentration on microstructure of electrodeposited Ni-Cu alloy films

Surface and Coatings Technology

Volumn 206, Issue 6, 2011, Pages 1430-1438

  Haciismailoglu, Murside ^a   Alper, Mürsel ^a  

^a ULUDAG UNIVERSITY   (Turkey)

Author keywords

Crystallographic texture; Electrodeposition; Electrolyte pH; Ferromagnetic films

Indexed keywords

AFM; CRYSTALLOGRAPHIC TEXTURES; CURRENT-TIME TRANSIENT; DEPOSITION PROCESS; FACE CENTERED CUBIC STRUCTURE; FERROMAGNETIC FILMS; INITIAL DEPOSITIONS; MICROSTRUCTURAL ANALYSIS; NI-CU ALLOY; PH VALUE; POLYCRYSTALLINE; POTENTIOSTATIC CONTROL; TEXTURE DEGREES; TI SUBSTRATES;

ALLOYS; ATOMIC FORCE MICROSCOPY; CERIUM ALLOYS; CONCENTRATION (PROCESS); COPPER; CRITICAL CURRENTS; ELECTRODEPOSITION; ELECTROLYTES; FERROMAGNETIC MATERIALS; METALLIC FILMS; NICKEL DEPOSITS; PH EFFECTS; POWER QUALITY; SCANNING ELECTRON MICROSCOPY; SURFACE MORPHOLOGY; SURFACE PROPERTIES; SURFACE ROUGHNESS; TEXTURES; TRANSIENTS; X RAY DIFFRACTION; X RAY DIFFRACTION ANALYSIS;

COPPER ALLOYS;

EID: 80055117100     PISSN: 02578972     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.surfcoat.2011.09.010     Document Type: Article

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