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Volumn , Issue , 2011, Pages

Complete short-circuit failure mode properties and comparison based on IGBT standard packaging. Application to new fault-tolerant inverter and interleaved chopper with reduced parts count

Author keywords

Failure mode; Fault tolerant capability; Interleaved converter; Packaging; Power Module; Short circuit failure

Indexed keywords

CRITICAL ENERGY; EXPLOSION ENERGY; FAULT-TOLERANT; FAULT-TOLERANT CAPABILITY; FAULTY DEVICES; INTERLEAVED CONVERTER; LOW ENERGIES; POWER MODULE; SHORT TERM; SHORT-CIRCUIT FAILURE; THERMAL CYCLING TEST;

EID: 80053485670     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper
Times cited : (20)

References (10)
  • 2
    • 33750134605 scopus 로고    scopus 로고
    • Acid Decapsulation of Epoxy Molded IC Packages with Copper Wire Bonds
    • July
    • Sarangapani Murali, Narasimalu Srikanth, "Acid Decapsulation of Epoxy Molded IC Packages With Copper Wire Bonds", IEEE Trans. On Electronics Packaging Manufacturing, Vol. 29, no 3, July 2006, pp. 179-183.
    • (2006) IEEE Trans. On Electronics Packaging Manufacturing , vol.29 , Issue.3 , pp. 179-183
    • Murali, S.1    Srikanth, N.2
  • 5
    • 0342652927 scopus 로고    scopus 로고
    • Estimation of the IGBT Silicon Temperature during Short-Circuit Condition in Order to Determine the Failure Mode
    • September
    • Calmon F., Chante J.-P., Reymond B.,"Estimation of the IGBT Silicon Temperature during Short-Circuit Condition in Order to Determine the Failure Mode", European Power Electronics Journal, Vol. 6, no 2, September 1996, pp. 25-32.
    • (1996) European Power Electronics Journal , vol.6 , Issue.2 , pp. 25-32
    • Calmon, F.1    Chante, J.-P.2    Reymond, B.3
  • 6
    • 0027681895 scopus 로고
    • Transient Thermal Response of Power Semiconductors to Short Power Pulses
    • October
    • Clemente S., "Transient Thermal Response of Power Semiconductors to Short Power Pulses", IEEE Trans. On Power Electronics, Vol. 8, no 4, October 1993, pp. 337-341.
    • (1993) IEEE Trans. On Power Electronics , vol.8 , Issue.4 , pp. 337-341
    • Clemente, S.1
  • 8
    • 0036875561 scopus 로고    scopus 로고
    • Failures-Tolerance and Remedial Strategies of a PWM Multicell Inverter
    • November
    • F. Richardeau, Ph. Baudesson, T. Meynard,"Failures-Tolerance and Remedial Strategies of a PWM Multicell Inverter", IEEE Transaction on Power Electronics, Vol. 17, no 6, 2002 November, pp. 905-912.
    • (2002) IEEE Transaction on Power Electronics , vol.17 , Issue.6 , pp. 905-912
    • Richardeau, F.1    Baudesson, Ph.2    Meynard, T.3
  • 10
    • 80052922859 scopus 로고    scopus 로고
    • New Redondancy Structures for Power Conversion
    • French Patent - INP Toulouse, University of Toulouse, University of Montpellier II, CNRS, n° request 1055523 / 1000084136 July 7
    • F.Richardeau, E.Sarraute, J.-J. Huselstein and Th. Martiré, "New Redondancy Structures for Power Conversion", French Patent - INP Toulouse, University of Toulouse, University of Montpellier II, CNRS, n° request 1055523 / 1000084136 - 2010, July 7.
    • (2010)
    • Richardeau, F.1    Sarraute, E.2    Huselstein, J.-J.3    Martiré, Th.4


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.