Acid decapsulation of epoxy molded IC packages with copper wire bonds

IEEE Transactions on Electronics Packaging Manufacturing

Volumn 29, Issue 3, 2006, Pages 179-183

  Murali, Sarangapani ^a   Srikanth, Narasimalu ^b  

^a SINGAPORE INSTITUTE OF MANUFACTURING TECHNOLOGY   (Singapore)

^b ASM Technology Singapore   (Singapore)

Author keywords

Acid decapsulation; Copper ball bonding; Epoxy molding compounds (EMCs); Thermosonic wire bonding; Wet decapping

Indexed keywords

COPPER CORROSION; EPOXY RESINS; INTEGRATED CIRCUITS; INTERFACES (MATERIALS); NITRIC ACID; SHEAR STRENGTH; SULFURIC ACID;

ACID DECAPSULATION; BOND INTERFACES; COPPER WIRE BONDS; EPOXY MOLDING COMPOUNDS (EMCS); THERMOSONIC WIRE BONDING;

ELECTRONICS PACKAGING;

EID: 33750134605     PISSN: 1521334X     EISSN: None     Source Type: Journal    
DOI: 10.1109/TEPM.2006.882499     Document Type: Article

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