Experimental and analytical studies on the high cycle fatigue of thin film metal on PET substrate for flexible electronics applications

IEEE Transactions on Components, Packaging and Manufacturing Technology

Volumn 1, Issue 1, 2011, Pages 43-51

  Alzoubi, K ^a   Lu, S ^a   Sammakia, B ^a   Poliks, M ^b  

^a State University of New York at Binghamton   (United States)

^b BINGHAMTON UNIVERSITY   (United States)

Author keywords

Flexible electronics; flexible substrates; high cyclic bending fatigue; thin films

Indexed keywords

CYCLIC BENDING; ELECTRICAL RESISTANCES; ELECTRONICS APPLICATIONS; FLEXIBLE SUBSTRATE; MICRO-ELECTRONIC DEVICES; POLYETHYLENE NAPHTHALATE; POLYETHYLENE TEREPHTHALATES (PET); SPUTTER-DEPOSITED COPPER;

CYCLIC LOADS; EXPERIMENTS; FATIGUE OF MATERIALS; FINITE ELEMENT METHOD; FLEXIBLE ELECTRONICS; LOADING; METAL COATINGS; MICROELECTRONICS; POLYETHYLENE TEREPHTHALATES; STRESS CONCENTRATION; THIN FILMS;

SUBSTRATES;

EID: 80053190808     PISSN: 21563950     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCPMT.2010.2100911     Document Type: Article

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