Fatigue behavior of thin Cu foils for flexible printed circuit board

Solid State Phenomena

Volumn 124-126, Issue PART 2, 2007, Pages 1369-1372

  Han, Seungwoo ^a   Seo, Kijeong ^a   Kim, Wandoo ^a   Lee, Hakjoo ^a   Lee, Hyunwoo ^b   Shin, Jaeho ^c   Lee, Jaejoon ^c  

^a Korea Institute of Machine and Materials   (South Korea)

^b Pusan National University   (South Korea)

^c Samsung Electro Mechanics   (South Korea)

Author keywords

Fatigue; Flexible printed circuit board; Thin copper foil

Indexed keywords

FATIGUE OF MATERIALS; LIQUID CRYSTAL DISPLAYS; METAL FOIL; MOBILE PHONES; PRINTED CIRCUIT BOARDS;

FLEXIBLE COPPER CLAD LAMINATE (FCCL); FLEXIBLE PRINTED CIRCUIT BOARDS; THIN COPPER FOIL;

COPPER ALLOYS;

EID: 38549122546     PISSN: 10120394     EISSN: None     Source Type: Book Series    
DOI: 10.4028/3-908451-31-0.1369     Document Type: Conference Paper

References (5)

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3. H. Hung and F. Spaepen: Acta Materialia, Vol. 48 (2000), p. 3261.
4. D. T. Read, Y. W. Cheng and R. Geiss: Microelectronic Engineering, Vol. 75 (2004), p. 63.
5. H. R. Le, M. P. Sutcliffe, P. Z. Wang and G. T. Burstein: Acta Materialia, Vol. 52 (2004), p. 911.