Experimental study of the high cycle fatigue of thin film metal on polyethylene terephthalate for flexible electronics applications

Proceedings of the ASME InterPack Conference 2009, IPACK2009

Volumn 1, Issue , 2010, Pages 27-32

  Alzoubi, Khalid ^a   Lu, Susan ^a   Sammakia, Bahgat ^a   Poliks, Mark ^b  

^a BINGHAMTON UNIVERSITY   (United States)

^b Endicott Interconnect Technologies   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

BULK MATERIALS; COATED SUBSTRATES; CRACK GROWTH RATES; CRACK INITIATION AND PROPAGATION; CRACK LENGTH; CYCLIC BENDING; ELECTRICAL RESISTANCES; ELECTRONIC SYSTEMS; EXPERIMENTAL STUDIES; FATIGUE LIFE; FLEXIBLE SUBSTRATE; HIGH CYCLE FATIGUE; LOW-COST DEVICES; MAGNIFICATION IMAGES; METAL FILM; MICRO-ELECTRONIC DEVICES; NEW PRODUCT DEVELOPMENT; PET SUBSTRATE; POLYETHYLENE NAPHTHALATE; SPUTTER-DEPOSITED COPPER; STATISTICAL ANALYSIS; SYSTEMS INTEGRATION; THIN FILM MATERIAL; THIN FILM METAL; TIME INTERVAL; ULTIMATE TENSILE STRENGTH; YIELD STRENGTH;

CHIP SCALE PACKAGES; CRACK PROPAGATION; CRACKS; DESIGN OF EXPERIMENTS; ELECTRIC RESISTANCE; ELECTRONIC EQUIPMENT MANUFACTURE; ELECTRONICS ENGINEERING; FATIGUE OF MATERIALS; FILM THICKNESS; FLEXIBLE ELECTRONICS; FLEXIBLE MANUFACTURING SYSTEMS; MATERIALS HANDLING EQUIPMENT; MECHANICAL PROPERTIES; MICROELECTRONICS; POLYETHYLENE TEREPHTHALATES; POLYETHYLENES; PRODUCT DEVELOPMENT; STRESSES; TENSILE STRENGTH; THERMOPLASTICS; THIN FILMS; VAPOR DEPOSITION;

SUBSTRATES;

EID: 77953747013     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1115/InterPACK2009-89247     Document Type: Conference Paper

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