High cycle fatigue resistance and reliability assessment of flexible printed circuitry

Journal of Electronic Packaging

Volumn 124, Issue 3, 2002, Pages 254-259

  Martynenko, Elena ^a   Zhou, Wen ^a   Chudnovsky, Alexander ^a   Li, Ron S ^b   Poglitsch, Larry ^b  

^a 1120 Science and Engineering Offices   (United States)

^b MOTOROLA INC   (United States)

Author keywords

Flexible Printed Circuitry (FPC); High Cycle Fatigue; Reliability Assessment; Thin Films

Indexed keywords

EID: 0041369606     PISSN: 10437398     EISSN: None     Source Type: Journal    
DOI: 10.1115/1.1462628     Document Type: Article

References (12)

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