An automatic inspection method for the fracture conditions of anisotropic conductive film in the TFT-LCD assembly process

International Journal of Optomechatronics

Volumn 5, Issue 3, 2011, Pages 286-298

  Lin, Chern Sheng ^a   Huang, Kuo Hon ^a   Lin, Tsung Chih ^a   Shei, Hung Jung ^b   Tien, Chuen Lin ^a  

^a FENG CHIA UNIVERSITY   (Taiwan)

^b CHINA UNIVERSITY OF SCIENCE AND TECHNOLOGY   (Taiwan)

Author keywords

Anisotropic conductive film; Automatic optical inspection; Fracture; Image processing; Thinning processing method

Indexed keywords

ANISOTROPIC CONDUCTIVE FILMS; ASSEMBLY PROCESS; AUTOMATIC INSPECTION; AUTOMATIC OPTICAL INSPECTION; AUTOMATIC PRODUCTION LINE; CONDUCTING PARTICLES; IMAGE GRADIENTS; IMAGE PROCESSING - METHODS; IMAGE PROCESSING TECHNOLOGY; INFORMATION CREATION; INFORMATION REDUCTION; NOISY ENVIRONMENT; OPTIMAL THRESHOLD; PARTICLE IMAGES; RECOGNITION ACCURACY; TEST PATTERN; TFT-LCDS; THINNING PROCESSING;

ANISOTROPY; ASSEMBLY; CONDUCTIVE FILMS; DEFORMATION; FRACTURE; IMAGE PROCESSING; INSPECTION; OPTICAL DATA PROCESSING; OPTICAL TESTING; PROCESSING; THIN FILM TRANSISTORS;

OPTICAL FILMS;

EID: 80053014014     PISSN: 15599612     EISSN: 15599620     Source Type: Journal    
DOI: 10.1080/15599612.2011.604114     Document Type: Article

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