Structural evolution of self-ordered alumina tapered nanopores with 100 nm interpore distance

Applied Surface Science

Volumn 257, Issue 24, 2011, Pages 10390-10394

  Li, Juan ^a,b,c   Li, Congshan ^a,c   Gao, Xuefeng ^a  

^a SUZHOU INSTITUTE OF NANO TECH AND NANO BIONICS   (China)

^b INSTITUTE OF BIOPHYSICS   (China)

^c UNIVERSITY OF CHINESE ACADEMY OF SCIENCES   (China)

Author keywords

Anodizing; Conical; Etching; Porous anodic alumina; Tapered

Indexed keywords

ALUMINA; ALUMINUM OXIDE; ALUMINUM SHEET; ANODIC OXIDATION; ASPECT RATIO; NANOPORES; OXALIC ACID;

CONICAL; ETCHING KINETICS; INTERPORE DISTANCES; POROUS ANODIC ALUMINA; PROFILE EVOLUTION; STRUCTURAL EVOLUTION; SYNERGETIC EFFECT; TAPERED;

ETCHING;

EID: 80052933133     PISSN: 01694332     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.apsusc.2011.06.097     Document Type: Article

References (36)

1. S.B. Lee, D.T. Mitchell, L. Trofin, T.K. Nevanen, H. Söderlund, and C.R. Martin Science 296 2002 2198
2. Y. Lei, and W. Chim J. Am. Chem. Soc. 127 2005 1487
3. W. Chen, Z. Wu, X. Xia, J. Xu, and H. Chen Angew. Chem. Int. Ed. 49 2010 7943
4. M. Steinhart, J.M. Wendorff, A. Greiner, R.B. Wehrspohn, K. Nielsch, J. Schilling, J. Choi, and U. Gösele Science 296 2002 1997
5. H. Masuda, and K. Fukuda Science 268 1995 1466
6. A.P. Li, F. Müller, A. Birner, K. Nielsch, and U. Gösele J. Appl. Phys. 84 1998 6023
7. G.E. Thompson Thin Solid Films 297 1997 192
8. S. Hwang, S. Jeong, H. Hwang, O. Lee, and K. Lee Korean J. Chem. Eng. 19 2002 467
9. I. Vrublevsky, V. Parkoun, J. Schreckenbach, and G. Marx Appl. Surf. Sci. 227 2004 282
10. S. Chu, K. Wada, S. Inoue, and M. Isogai Adv. Mater. 17 2005 2115
11. W. Lee, R. Ji, U. Gösele, and K. Nielsch Nat. Mater. 5 2006 741
12. K. Lee, Y. Tang, and M. Ouyang Nano Lett. 8 2008 4624
13. S. Ono, M. Saito, and H. Asoh Electrochim. Acta 51 2005 827
14. H. Masuda, H. Yamada, M. Satoh, H. Asoh, M. Nakao, and T. Tamamura Appl. Phys. Lett. 71 1997 2770
15. W. Lee, R. Ji, C.A. Ross, U. Gösele, and K. Nielsch Small 2 2006 978
16. S. Fournier-Bidoz, V. Kitaev, D. Routkevitch, I. Manners, and G.A. Ozin Adv. Mater. 16 2004 2193
17. R. Krishnan, and C.V. Thompson Adv. Mater. 19 2007 988
18. D. Li, L. Zhao, C. Jiang, and J.G. Lu Nano Lett. 10 2010 2766
19. W. Lee, K. Schwirn, M. Steinhert, E. Pipple, R. Scholz, and U. Gösele Nat. Nanotechnol. 3 2008 234
20. P. Hoyer, K. Nishio, and H. Masuda Thin Solid Films 286 1996 88
21. T. Yanagishita, K. Yasui, T. Kondo, Y. Kawamoto, K. Nishio, and H. Masuda Chem. Lett. 36 2007 530
22. K. Choi, S.H. Park, Y.M. Song, Y.T. Lee, C.K. Hwangbo, H. Yang, and H.S. Lee Adv. Mater. 22 2010 3713
23. Y. Yamauchi, L. Wang, H. Ataee-Esfahani, N. Fukata, T. Nagaura, and S. Inoue J. Nanosci. Nanotechnol. 10 2010 4384
24. T. Nagaura, F. Takeuchi, Y. Yamauchi, K. Wada, and S. Inoue Electrochem. Commun. 10 2008 681
25. T. Yanagishita, K. Nishio, and H. Masuda Appl. Phys. Express 1 2008 067004
26. D.J. LeClere, G.E. Thompson, and B. Derby Nanotechnology 20 2009 245304
27. Y. Yamauchi, T. Nagaura, A. Ishikawa, T. Chikyow, and S. Inoue J. Am. Chem. Soc. 130 2008 10165
28. T. Yanagishita, T. Endo, K. Nishio, and H. Masuda Jpn. J. Appl. Phys. 49 2010 065202
29. T. Yanagishita, T. Endo, Y. Yamaguchi, K. Nishio, and H. Masuda Chem. Lett. 38 2009 274
30. Y. Yamauchi, T. Nagaura, K. Takai, N. Suzuki, K. Sato, N. Fukata, S. Inoue, and S. Kishimoto J. Phys. Chem. C 113 2009 9632
31. T. Yanagishita, T. Kondo, K. Nishio, and H. Masuda J. Vac. Sci. Technol. B 26 2008 1856
32. T. Nagaura, F. Takeuchi, and S. Inoue Electrochim. Acta 53 2008 2109
33. J.P. O'Sullivan, and G.C. Wood Proc. R. Soc. Lond. A 317 1970 511
34. W. Chen, J. Wu, and X. Xia ACS Nano 2 2008 959
35. G.E. Thompson, and G.C. Wood Nature 290 1981 230
36. I. Vrublevsky, V. Parkoun, V. Sokol, and J. Schreckenbach Appl. Surf. Sci. 236 2004 270