Numerical analysis of electrodeposition in microcavities

Electrochimica Acta

Volumn 56, Issue 24, 2011, Pages 8260-8271

  Haghdoost, A ^a   Pitchumani, R ^a  

^a State University   (United States)

Author keywords

Electrodeposition; LIGA; Micromanufacturing; Micromolding; Overplating

Indexed keywords

APPLIED VOLTAGES; COMPUTATIONAL MODEL; CURRENT DENSITY PROFILES; ELECTROCHEMICAL PHENOMENA; IN-PROCESS; LIGA; METALLIC MICROSTRUCTURES; MICRO PART; MICRO-MOLDS; MICROMANUFACTURING; MICROMOLDING; OVERPLATING; PART QUALITY;

ELECTROFORMING; LITHOGRAPHY; MICROCAVITIES; MOLDING; NUMERICAL ANALYSIS;

ELECTRODEPOSITION;

EID: 80052807134     PISSN: 00134686     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.electacta.2011.06.084     Document Type: Article

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