Two-dimensional modeling of nickel electrodeposition in LIGA microfabrication

Microsystem Technologies

Volumn 10, Issue 6-7, 2004, Pages 444-450

  Chen, K S ^a   Evans, G H ^b  

^a SANDIA NATIONAL LABORATORIES   (United States)

^b SANDIA NATIONAL LABORATORIES   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CURRENT DENSITY; DISSOCIATION; FABRICATION; FINITE ELEMENT METHOD; GRAIN SIZE AND SHAPE; LAGRANGE MULTIPLIERS; MICROSTRUCTURE; NICKEL; PH EFFECTS;

ARBITRARY LAGRANGIAN-EULERIAN (ALE) FORMULATION; CHARGED SPECIES; COUPLED SPECIES; MULTIPLE IONIC SPECIES;

ELECTRODEPOSITION;

EID: 10044279523     PISSN: 09467076     EISSN: None     Source Type: Journal    
DOI: 10.1007/s00542-004-0373-8     Document Type: Conference Paper

References (6)

1. Griffiths SK et al (1998) Modeling electrodeposition for LIGA microdevice fabrication. Microsys Tech 4: 98-101
2. Chen KS (2003) Modeling electrodeposition in LIGA microfabrication using an arbitrary-Lagrangian-Eulerian formulation for moving boundary tracking with repeated re-meshing. In: Mammoli AA, Brebbia CA (eds), Moving Boundaries VII: Computational Modeling of Free and Moving Boundary Problems. WIT Press Southampton, Boston, pp 245-255
3. Schunk PR et al (1997) Goma 2.0 - a full-Newton finite element program for free and moving boundary problems with coupled fluid/solid momentum, energy, mass, and chemical species transport: user's guide, Sandia Laboratories technical report SAND97-2404
4. CUBIT, Version 8.0, Sandia National Laboratories (2003) URL: http://endo.sandia.gov/cubit
5. Wellman GW (1999) MAPVAR - a computer program to transfer solution data between finite element meshes. Sandia Laboratories technical report SAND97-0466
6. Domeier LA et al (2002) Microscreen-based replication of electroforming micromolds. Microsys Tech 8: 78-82