Design and measurement of matched wire bond and flip chip interconnects for D-band system-in-package applications

IEEE MTT-S International Microwave Symposium Digest

Volumn , Issue , 2011, Pages

  Beer, S ^a   Ripka, B ^a   Diebold, S ^a   Gulan, H ^a   Rusch, C ^a   Pahl, P ^a   Zwick, T ^a  

^a KARLSRUHE INSTITUTE OF TECHNOLOGY   (Germany)

Author keywords

Flip chip; Millimeter wave devices; millimeter wave integrated circuits; packaging; Radar

Indexed keywords

FLIP CHIP; FLIP CHIP INTERCONNECTS; FREQUENCY RANGES; HALF-WAVE; MILLIMETER WAVE INTEGRATED CIRCUITS; OFF-CHIP; PLASTIC PACKAGES; SIMULATION AND MEASUREMENT; SYSTEM IN PACKAGE; SYSTEM-IN-PACKAGE APPLICATIONS; WIRE BONDS;

ELECTRONIC EQUIPMENT TESTING; MILLIMETER WAVE DEVICES; MILLIMETER WAVES; MONOLITHIC MICROWAVE INTEGRATED CIRCUITS; WIRE;

CHIP SCALE PACKAGES;

EID: 80052324166     PISSN: 0149645X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/MWSYM.2011.5972851     Document Type: Conference Paper

References (12)

1. K. Schmalz, W. Winkler, J. BorngräBer, W. Debski, B. Heinemann, J. C. Scheytt, "122 GHz Ism-Band Transceiver Concept and Silicon ICs for Low-Cost Receiver in Sige Bicmos", IEEE MTT-S Int. Microwave Symposium (IMS) 2010, Anaheim CA, USA, May 2010
2. I. Sarkas, E. Laskin, J. Hasch, P. Chevalier, and S. P. Voinigescu, "Second Generation Transceivers for D-Band Radar and Data Communication Applications", IEEE MTT-S Int. Microwave Symposium (IMS) 2010, Anaheim CA, USA, May 2010
3. Zhang, Y.P.; Duixian Liu; "Antenna-on-Chip and Antenna-in-Package Solutions to Highly Integrated Millimeter-Wave Devices for Wireless Communications," Antennas and Propagation, IEEE Transactions on, vol.57, no.10, pp.2830-2841, Oct. 2009
4. T. Zwick, D. Liu, B. Gaucher, "Broadband planar superstrate antenna for integrated mmWave transceivers," IEEE Trans. Antennas and Propagation, vol. 54, no. 10, pp. 2790-2796, October 2006. (Pubitemid 44603858)
5. T. Krems et al., "Coplanar wire bond interconnections for millimeterwave applications," Electrical Performance of Electronic Packaging, 1995, pp.178-180, 2-4 Oct 1995
6. Goossen, K.W., "On the design of coplanar wire bonds as transmission lines," Microwave and Guided Wave Letters, IEEE, vol.9, no.12, pp.511-513, Dec 1999 (Pubitemid 30558824)
7. Harkness, S.; Meirhofer, J.; LaMeres, B.J.;, "Controlled impedance chip-to-chip interconnect using coplanar wire bond structures,"Electrical Performance of Electronic Packaging, 2008 IEEE-EPEP, vol., no., pp.267-270, 27-29 Oct. 2008
8. Semiconductor packaging. - 2. Print, New York, NY: Chapman & Hall, 1999; (Microelectronics packaging handbook; 2)
9. Krems, T.; Haydll, W.H.; Massler, H.; Rudiger, J., "Advantages of flip chip technology in millimeter-wave packaging," Microwave Symposium Digest, 1997., IEEE MTT-S International, vol.2, pp.987-990 vol.2, 8-13 Jun 1997
10. Jentzsch, A.; Heinrich, W., "Theory and measurements of flip-chip interconnects for frequencies up to 100 GHz," Microwave Theory and Techniques, IEEE Transactions on, vol.49, no.5, pp.871-878, May 2001 (Pubitemid 32508561)
11. Pfeiffer, U.R.; Chandrasekhar, A., "Characterization of flip-chip interconnects up to millimeter-wave frequencies based on a nondestructive in situ approach," Advanced Packaging, IEEE Transactions on, vol.28, no.2, pp. 160- 167, May 2005
12. http://www.success-project.eu