Programmable self-assembly for microsystem integration

2011 16th International Solid-State Sensors, Actuators and Microsystems Conference, TRANSDUCERS'11

Volumn , Issue , 2011, Pages 848-853

  Hoo, J H ^a   Park, K S ^a   Baskaran, R ^a,b   Bohringer K F ^a  

^a University of Washington   (United States)

^b INTEL CORPORATION   (United States)

Author keywords

assembly; heterogeneous integration; packaging; Self assembly

Indexed keywords

HETEROGENEOUS INTEGRATION; MICRO-SCALES; PACKAGING TECHNIQUES; PACKAGING TECHNOLOGIES;

ACTUATORS; ELECTRONICS INDUSTRY; MICROSYSTEMS; SELF ASSEMBLY;

SOLID-STATE SENSORS;

EID: 80052107718     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/TRANSDUCERS.2011.5969886     Document Type: Conference Paper

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