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Fan Xu, Dong Jiang, Jing Wang, Fred Wang, Leon M. Tolbert, Timothy Junghee Han, Jim Nagashima, Sung Joon Kim, "High Temperature Packaging of 50kW Three-Phase SiC Power Module", Proceedings of the 8th International Conference on Power Electronics (ICPE) -ECCE Asia, Jeju, Korea, 30 May, 2011.
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Narjes Boughrara, Sabrine Moumen, Stéphane Lefebvre, Zoubir Khatir, Peter Friedrichs, and Jean-Claude Faugières, "Robustness of SiC JFET in Short-Circuit Modes" IEEE Electron Device Letters, Vol. 30, No. 1, pp. 51-53, January 2009.
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WA23
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Fabien Dubois, Dominique Bergogne, Damien Risaletto, Remi Robutel, Herve Morel, Regis Meuret, and Sonia Dhokkar, "High Temperature Inverter for Airborne Application", IMAPS International Conference & Exibition on High Temperature Electronics(HiTEC), WA23, 2010.
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