Properties of spin coated epoxy/silica thin film composites: Effect of nano- and micron-size fillers

Composites Part A: Applied Science and Manufacturing

Volumn 42, Issue 10, 2011, Pages 1432-1437

  Foo, Evon ^a   Jaafar, Mariatti ^a   Aziz, Azizan ^a   Sim, Lim Chong ^b  

^a SCHOOL OF MATERIALS AND MINERAL RESOURCES ENGINEERING   (Malaysia)

^b Intel Technology Malaysia Sdn Bhd   (Malaysia)

Author keywords

A. Nano structures; A. Thin films; B. Thermal properties; E. Thermosetting resin

Indexed keywords

A. NANO-STRUCTURES; A. THIN FILMS; EQUIVALENT THERMAL; HIGH DENSITY; LOW COEFFICIENT OF THERMAL EXPANSIONS; MECHANICAL AND THERMAL PROPERTIES; NANO-SILICA; SILICA FILLER; SURFACE AREA; THIN FILM COMPOSITES; THIN FILM FABRICATION; VOLUME RATIO; WEIGHT FRACTIONS;

CARBON FIBER REINFORCED PLASTICS; COATINGS; ELECTRONICS PACKAGING; FILLERS; FILM THICKNESS; MECHANICAL PROPERTIES; SILICA; TENSILE STRENGTH; THERMAL EXPANSION; THERMODYNAMIC PROPERTIES; THERMOSETS; THIN FILMS;

NANOCOMPOSITE FILMS;

EID: 80052024686     PISSN: 1359835X     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.compositesa.2011.06.007     Document Type: Article

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