Using silica nanoparticles as curing reagents for epoxy resins to form epoxy-silica nanocomposites

Journal of Applied Polymer Science

Volumn 95, Issue 5, 2005, Pages 1237-1245

  Liu, Ying Ling ^a   Li, Shu Hsien ^a  

^a CHUNG YUAN CHRISTIAN UNIVERSITY   (Taiwan)

Author keywords

Curing of polymers; Epoxy; Nanocomposites; Nanoparticles; Silicas

Indexed keywords

ACTIVATION ANALYSIS; CURING; DIFFERENTIAL SCANNING CALORIMETRY; ENERGY DISPERSIVE SPECTROSCOPY; ENERGY GAP; EPOXY RESINS; MAGNESIUM COMPOUNDS; NANOSTRUCTURED MATERIALS; PARTICLE SIZE ANALYSIS; SCANNING ELECTRON MICROSCOPY; THERMODYNAMIC STABILITY;

CURING OF POLYMERS; EPOXY; MAGNESIUM CHLORIDE; ZINC ACETYLACETONATE;

SILICA;

NANOCOMPOSITE;

EID: 13844271397     PISSN: 00218995     EISSN: None     Source Type: Journal    
DOI: 10.1002/app.21327     Document Type: Article

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