Reliability of OTFTs on flexible substrate: Mechanical stress effect

EPJ Applied Physics

Volumn 55, Issue 2, 2011, Pages

  Bensaid, B ^a   Boddaert, X ^a   Benaben, P ^a   Gwoziecki, R ^b   Coppard, R ^b  

^a ECOLE DES MINES DE SAINT ETIENNE   (France)

^b CEA GRENOBLE   (France)

Author keywords

[No Author keywords available]

Indexed keywords

AMBIENT AIR; BIAS STRESS; COMPRESSION AND TENSION; CYCLIC BENDING TESTS; DEVICE CHARACTERISTICS; ELECTRICAL CHARACTERISTIC; ELECTRICAL PERFORMANCE; FLEXIBLE SUBSTRATE; GOOD STABILITY; INORGANIC MATERIALS; LARGE-AREA ELECTRONICS; MECHANICAL BEHAVIOR; MECHANICAL STRESS; ORGANIC THIN FILM TRANSISTORS; PLASTIC SUBSTRATES; PRINTED ORGANIC ELECTRONICS; PRINTING TECHNOLOGIES; TECHNOLOGICAL BREAKTHROUGHS; TRANSFER CHARACTERISTICS;

AMORPHOUS FILMS; BENDING TESTS; FLEXIBLE ELECTRONICS; MICROELECTRONICS; RELIABILITY; STRESSES; SUBSTRATES; THIN FILM DEVICES; THIN FILM TRANSISTORS; THIN FILMS; TRANSISTORS;

ORGANIC FIELD EFFECT TRANSISTORS;

EID: 80051995514     PISSN: 12860042     EISSN: 12860050     Source Type: Journal    
DOI: 10.1051/epjap/2011100426     Document Type: Article

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