Anodic bonding of activated tin solder alloys in the liquid state: A novel large-area hermetic glass sealing method

Solar Energy Materials and Solar Cells

Volumn 95, Issue 11, 2011, Pages 3001-3008

  Koebel, Matthias M ^a   El Hawi, Nancy ^a   Lu, Jia ^a   Gattiker, Felix ^a   Neuenschwander, Jürg ^a  

^a SWISS FEDERAL LABORATORIES FOR MATERIALS SCIENCE AND TECHNOLOGY   (Switzerland)

Author keywords

Anodic bonding; Glass to metal seal; Hermeticity; Interface analysis; Shear strength; Tin alloy

Indexed keywords

ACTIVATING METALS; ANODIC BONDING; BONDING INTERFACES; BONDING TEMPERATURES; CONVENTIONAL METHODS; ELEMENT MAPPING; FLOAT GLASS SUBSTRATES; GLASS SUBSTRATES; HERMETICITY; INTERFACE ANALYSIS; INTERFACE BONDS; JOINT PERFORMANCE; LIQUID STATE; METAL SEALING; OLED TECHNOLOGY; SEALING APPLICATIONS; SOLDER ALLOYS; SURFACE PRETREATMENT; TEST SPECIMENS; VACUUM GLAZING;

ALLOYS; ENGINEERING EXHIBITIONS; GLASS; LIQUIDS; METALS; OPTICAL MICROSCOPY; SEALS; SHEAR STRENGTH; SUBSTRATES; TIN; VACUUM; VACUUM APPLICATIONS;

GLASS BONDING;

EID: 80051547887     PISSN: 09270248     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.solmat.2011.06.012     Document Type: Article

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