Fabrication of strongly anchored, high aspect ratio elastomeric microwires for mechanical and optical applications

Journal of Micromechanics and Microengineering

Volumn 21, Issue 8, 2011, Pages

  Lee, Jiwon ^a   Kim, Jaeyoun ^a  

^a Iowa State University   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

FABRICATED ARRAYS; HIGH ASPECT RATIO; LIGHTPIPES; MICRO WIRE; MINIATURIZED SYSTEMS; OPTICAL APPLICATIONS; OPTICAL CHARACTERIZATION; OUT-OF-PLANE; POLYDIMETHYLSILOXANE PDMS; PULLING FORCE; SUPPORTING STRUCTURE; SURFACE SMOOTHNESS; TWO-POINT;

ELASTICITY; FABRICATION; MICROCHANNELS;

ASPECT RATIO;

EID: 80051501552     PISSN: 09601317     EISSN: 13616439     Source Type: Journal    
DOI: 10.1088/0960-1317/21/8/085016     Document Type: Article

References (31)

1. Bergbreiter S, Mahajan D and Pister K S J 2009 J. Micromech. Microeng. 19 055009
2. Madangopal R, Khan Z A and Agrawal S K 2006 IEEE/ASME Trans. Mechatronics 4 433-8
3. Cho I K, Ryu J H and Jeong M Y 2008 Opt. Lett. 33 1881-3
4. Monat C, Domachuk P, Grillet C, Collins M, Eggleton B J, Cronin-Golomb M, Mutzenich S, Mahmud T, Rosengarten G and Mitchell A 2008 Microfluid. Nanofluid. 4 81-95
5. Lee L P and Szema R 2005 Science 310 1148-50
6. Xing X, Wang Y and Li B 2008 Opt. Express 16 10815-22
7. Tong L, Hu L, Zhang J, Qiu J, Yang Q, Lou J, Shen Y, He J and Ye Z 2006 Opt. Express 14 82-7
8. Harfenist S A, Cambron S D, Nelson E W, Berry S M, Isham A W, Crain M M, Walsh K M, Keynton R S and Cohn R W 2004 Nano Lett. 4 1931-7
9. Spina G L, Stefanini C, Menciassi A and Dario P 2005 J. Micromech. Microeng. 15 1576-87
10. Nain A S, Phillippi J A, Sitti M, MacKrell J, Campbell P G and Amon C 2008 Small 4 1153-9
11. Li D, Wang Y and Xia Y 2003 Nano Lett. 3 1167-71
12. Teo W E and Ramakrishna S 2006 Nanotechnology 17 R89
13. Kessick R and Tepper G 2006 Sensors Actuators B 117 205-10
14. Pisignano D, Maruccio G, Mele E, Persano L, Benedetto F D and Cingolani R 2005 Appl. Phys. Lett. 87 123109
15. Jeong W, Kim J, Kim S, Lee S, Mensing G and Beebe D J 2004 Lab Chip 4 576-8
16. Lee J and Kim J 2011 Proc. IEEE 24th Annu. Int. Conf. Micro-Electro-Mechanical-Systems (MEMS 2011) (Sorrento, Italy) pp 264-7
17. Engel J M, Chen J, Chang L and Bullen D 2006 IEEE/ASME J. Microelectromech. Syst. 15 729-36
18. Takeuchi S, Ziegler D, Yoshida Y, Mabuchi K and Suzuki T 2005 Lab Chip 5 519-23
19. Yuan G, Wu X, Yoon Y K and Allen M G 2005 Proc. IEEE 18th Annu. Int. Conf. Micro-Electro-Mechanical-Systems (MEMS 2005) (Miami Beach, FL) p 411-4
20. Schaper C D 2004 Proc. SPIE 5374 325
21. Wang S, Zeng C, Lai S, Juang Y J, Yang Y and Lee L J 2005 Adv. Mater. 17 1182-6
22. Dharmatilleke S, Henderson H T, Bhansali S and Ahn C H 2004 Proc. SPIE 4177 83
23. Vazquez G, Alvarez E and Navaza J M 1995 J. Chem. Eng. Data 40 611-4
24. Varga O H 1966 Stress-Strain Behaviour of Elastic Materials (New York: Interscience) p 96
25. Pelrine R, Kornbluh R, Joseph J, Heydt R, Pei Q and Chiba S 2000 Mater. Sci. Eng. C 11 89-100
26. Lin P and Yang S 2009 Soft. Matter 5 1011-8
27. Lotters J C, Olthuis W, Veltink P H and Bergveld P 1997 J. Micromech. Microeng. 7 145-7
28. Armani D, Liu C and Aluru N 1999 Proc. IEEE Int. 12th Annu. Int. Conf. Micro-Electro-Mechanical-Systems (MEMS 1999) (Orlando, FL) pp 222-7
29. Eddington D T, Crone W C and Beebe D J 2003 Proc. μ TAS 2003: Int. Conf. of Miniaturized Systems for Chemistry and Life Sciences (Squaw Valley, CA) pp 1089-92
30. Kofod G and Sommer-Larsen P 2005 Sensors Actuators A 122 273-83
31. Ogden R W 1972 Proc. R. Soc. A 326 565-84