Low formaldehyde emission particleboard panels realized through a new acrylic binder

Journal of Applied Polymer Science

Volumn 122, Issue 4, 2011, Pages 2779-2788

  Amazio, Paola ^a   Avella, Maurizio ^a   Emanuela Errico, Maria ^a   Gentile, Gennaro ^a   Balducci, Francesco ^b   Gnaccarini, Alessio ^b   Moratalla, Julian ^c   Belanche, Manuel ^c  

^a Istituto di Chimica e Tecnologia dei Polimeri   (Italy)

^b Consorzio Del Mobile Galleria Roma ^*  (Italy)

^c AIDIMA   (Spain)

Author keywords

adhesives; composites; curing of polymers

Indexed keywords

ACRYLIC RESINS; CURING OF POLYMERS; ETHOXYLATED BISPHENOL-A DIMETHACRYLATE; FORMALDEHYDE EMISSION; FORMALDEHYDE RELEASE; METHACRYLIC MONOMERS; PARTICLEBOARD PANELS; PARTICLEBOARD PRODUCTION; THERMAL INSULATION PROPERTIES; THICKNESS SWELLING; UREA FORMALDEHYDE;

FORMALDEHYDE; MECHANICAL PROPERTIES; PARTICLE BOARD; PHENOLS; THERMAL INSULATION; UREA; UREA FORMALDEHYDE RESINS; WATER ABSORPTION;

BINDERS;

EID: 80051475006     PISSN: 00218995     EISSN: 10974628     Source Type: Journal    
DOI: 10.1002/app.34327     Document Type: Article

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