Curing kinetics of tannin-phenol-formaldehyde adhesives as determined by DSC

Journal of Thermal Analysis and Calorimetry

Volumn 70, Issue 1, 2002, Pages 19-28

  Vazquez G ^a   Gonzalez Alvarez J ^a   Lopez Suevos F ^a   Freire, S ^a   Antorrena, G ^a  

^a UNIVERSITY OF SANTIAGO DE COMPOSTELA   (Spain)

Author keywords

Curing kinetics; DSC; Phenolic resin; Pinus pinaster bark; Tannin phenol formaldehyde resin; Tannins

Indexed keywords

ADHESIVES; COMPUTER SIMULATION; COMPUTER SOFTWARE; CURING; DIFFERENTIAL SCANNING CALORIMETRY; FORMALDEHYDE; PHENOLS; PLYWOOD; REACTION KINETICS;

CURING KINETICS;

PHENOLIC RESINS;

EID: 0036028823     PISSN: 14182874     EISSN: None     Source Type: Journal    
DOI: 10.1023/A:1020680928311     Document Type: Article

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