Manufacture and properties of low-density binderless particleboard from kenaf core

Journal of Wood Science

Volumn 50, Issue 1, 2004, Pages 62-67

  Xu, Jianying ^a   Sugawara, Ryo ^b   Widyorini, Ragil ^a   Han, Guangping ^a   Kawai, Shuichi ^a  

^a KYOTO UNIVERSITY   (Japan)

^b PANASONIC CORPORATION   (Japan)

Author keywords

Binderless particleboard; Kenaf core; Low density; Sound absorption coefficient; Thermal conductivity

Indexed keywords

ACOUSTIC WAVE ABSORPTION; DENSITY MEASUREMENT (SPECIFIC GRAVITY); PRESSING (FORMING); PRESSURE EFFECTS; STEAM;

STEAM INJECTION PRESSING;

PARTICLE BOARD;

DENSITY MEASUREMENT; KENAF; PARTICLE BOARDS; PRESSING; SOUND ABSORPTION; STEAMING;

HIBISCUS CANNABINUS;

EID: 4043084996     PISSN: 14350211     EISSN: None     Source Type: Journal    
DOI: 10.1007/s10086-003-0522-1     Document Type: Article

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