Quantitative in situ TEM tensile testing of an individual nickel nanowire

Nanotechnology

Volumn 22, Issue 35, 2011, Pages

  Lu, Yang ^a   Peng, Cheng ^a   Ganesan, Yogeeswaran ^a   Huang, Jian Yu ^b   Lou, Jun ^a  

^a Rice University   (United States)

^b SANDIA NATIONAL LABORATORIES   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

DAMAGE MECHANISM; ENGINEERING STRAINS; EXPERIMENTAL SETUP; HIGH-RESOLUTION TEM; IN-SITU; IN-SITU TEM; IN-SITU TENSILE TEST; METALLIC NANOWIRES; MICRO-MECHANICAL; NANO SCALE; NICKEL NANOWIRES; SCANNING ELECTRON MICROSCOPES; TRANSMISSION ELECTRON MICROSCOPE;

DISPLAY DEVICES; ELECTRON DEVICE TESTING; ELECTRON MICROSCOPES; EXPERIMENTS; NANOWIRES; SCANNING ELECTRON MICROSCOPY; TRANSMISSION ELECTRON MICROSCOPY;

TENSILE TESTING;

EID: 79961231849     PISSN: 09574484     EISSN: 13616528     Source Type: Journal    
DOI: 10.1088/0957-4484/22/35/355702     Document Type: Article

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