Effect of Sn grain structure on electromigration reliability of Pb-free solders

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2011, Pages 711-716

  Wang, Yiwei ^a   Lu, Kuan H ^a   Gupta, Vikas ^b   Stiborek, Leon ^b   Shirley, Dwayne ^b   Im, Jay ^a   Ho, Paul S ^a  

^a The University of Texas at Austin   (United States)

^b TEXAS INSTRUMENTS   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ANISOTROPIC PROPERTY; ELECTROMIGRATION RELIABILITY; ELECTRON BACKSCATTERING DIFFRACTION; FLIP-CHIP PACKAGES; GRAIN ORIENTATION; GRAIN SIZE; INTERMETALLIC COMPOUND GROWTHS; MICROSTRUCTURAL ANALYSIS; PB FREE SOLDERS; PB-FREE SOLDER BUMP; SN GRAINS; SOLDER REFLOW; VOID FORMATION;

BACKSCATTERING; CRYSTAL MICROSTRUCTURE; ELECTROMIGRATION; GRAIN SIZE AND SHAPE; GROWTH KINETICS; INTERMETALLICS; LEAD; RELIABILITY; SOLDERING; SOLDERING ALLOYS;

TIN;

EID: 79960406333     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2011.5898591     Document Type: Conference Paper

References (11)

1. S. K. Kang and A. K. Sarkhel, "Lead (Pb)-Free Solders for Electronic Packaging", Journal of Electronic Materials, Vol. 23, No. 8, 1994, pp. 701-707.
2. B. F. Dyson, et al., "Interstitial Diffusion of Copper in Tin", Journal of Applied Physics, Vol. 38, No. 8, 1967, pp. 3408
3. D. C. Yeh, et al., "Extreme Fast Diffusion System: Nickel in Single Crystal Tin", Physics Review Letter, Vol. 53, No. 15, 1984, pp. 1469-1472
4. M. Lu, et al., "Effect of Sn Grain Orientation on Electromigraiton Degradation Mechanism in High Sn-Based Pb-Free Solders", Applied Phsics Letters, Vol. 92, 211909(2008).
5. T. R. Bieler, et al., "Influence of the Sn Grain Size and Orientation on the Thermomechanical Response and Reliability of Pb-free Solder Joints", IEEE Transactions on Components and Packaging Technologies, Vlo. 31, No. 2, 2008, pp. 370-381.
6. th Electronic Components and Technology Conference, Orlando, FL, May 2008, pp. 75-81.
7. S. K. Seo, et al., "The evolution of Microstructure and Microhardness of Sn-Ag and Sn-Cu Solders During High Temperature Aging", Microelectronics Reliability, Vol. 49, 2009, pp. 288-295.
8. th Electronic Components and Technology Conference, Orlando, FL, May 2008, pp. 360-365.
9. th Electronic Components and Technology Conference, San Diego, CA, May 2009, pp. 922-929.
10. M. Ding, Ph. D. Thesis, University of Texas at Austin, 2007.
11. "EBSD Based Analysis of Lead Free Solders", EDAX Newsletter, Vol. 7, No. 2.