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Acta Materialia

Volumn 59, Issue 14, 2011, Pages 5758-5764

Effect of stacking fault energy on mechanical behavior of bulk nanocrystalline Cu and Cu alloys

(5) Youssef, Khaled a Sakaliyska, Miroslava b Bahmanpour, Hamed a Scattergood, Ronald a Koch, Carl a

a North Carolina State University (United States)

b IFW DRESDEN (Germany)

Author keywords

Copper alloys; Mechanical properties; Nanocrystalline; Stacking faults

Indexed keywords

COARSE-GRAINED MATERIALS; CU ALLOY; DEFORMATION MECHANISM; DEFORMATION TWIN; DEFORMATION TWINNING; DISLOCATION SLIP; DISLOCATION SUBSTRUCTURES; HIGHER YIELD; IN-SITU; MECHANICAL BEHAVIOR; METALS AND ALLOYS; NANOCRYSTALLINE; NANOCRYSTALLINE CU; NANOCRYSTALLINES; ROOM TEMPERATURE; STACKING FAULT ENERGIES; ULTRA-HIGH; UNIFORM ELONGATION;

CERIUM ALLOYS; DEFORMATION; ELECTRON ENERGY LOSS SPECTROSCOPY; HIGH RESOLUTION ELECTRON MICROSCOPY; HIGH RESOLUTION TRANSMISSION ELECTRON MICROSCOPY; METALLURGY; NANOCRYSTALLINE ALLOYS; PLASTICITY; STACKING FAULTS; STRAIN HARDENING; TENSILE STRENGTH; TRANSMISSION ELECTRON MICROSCOPY;

COPPER ALLOYS;

EID: 79960390192 PISSN: 13596454 EISSN: None Source Type: Journal
DOI: 10.1016/j.actamat.2011.05.052 Document Type: Article

Times cited : (132)

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