Quantitative prediction of twinning stress in fcc alloys: Application to Cu-Al

Physical Review B - Condensed Matter and Materials Physics

Volumn 79, Issue 21, 2009, Pages

  Kibey, Sandeep A ^a   Wang, L L ^b   Liu, J B ^b   Johnson, H T ^a   Sehitoglu, H ^a   Johnson, D D ^a,b  

^a University of Illinois at Urbana Champaign   (United States)

^b UNIVERSITY OF ILLINOIS AT URBANA CHAMPAIGN   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 67650092918     PISSN: 10980121     EISSN: 1550235X     Source Type: Journal    
DOI: 10.1103/PhysRevB.79.214202     Document Type: Article

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