Tougher ultrafine grain Cu via high-angle grain boundaries and low dislocation density

Applied Physics Letters

Volumn 92, Issue 8, 2008, Pages

  Zhao, Y H ^a,f   Bingert, J F ^a   Zhu, Y T ^a   Liao, X Z ^b   Valiev, R Z ^c   Horita, Z ^d   Langdon, T G ^e   Zhou, Y Z ^f   Lavernia, E J ^f  

^a LOS ALAMOS NATIONAL LABORATORY   (United States)

^b UNIVERSITY OF SYDNEY   (Australia)

^c Birsk Branch of Federal State Budgetary Educational Establishment of Higher Education Bashkir State University   (Russian Federation)

^d KYUSHU UNIVERSITY   (Japan)

^e UNIVERSITY OF SOUTHERN CALIFORNIA   (United States)

^f University of California   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

DISLOCATIONS (CRYSTALS); GRAIN BOUNDARIES; MICROSTRUCTURE; STRAIN HARDENING; TOUGHNESS; YIELD STRESS;

DISLOCATION DENSITY; MICROSTRUCTURAL FEATURES; ULTRAFINE GRAIN;

COPPER;

EID: 40049110433     PISSN: 00036951     EISSN: None     Source Type: Journal    
DOI: 10.1063/1.2870014     Document Type: Article

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