Ni/Cu/Sn bumping scheme for fine-pitch micro-bump connections

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2011, Pages 109-113

  Zhang, W ^a   Limaye, B Dimcic P ^a   Manna, A L ^a   Soussan, P ^a   Beyne, E ^a  

^a IMEC   (Belgium)

Author keywords

[No Author keywords available]

Indexed keywords

3-D INTEGRATION; BLANKET FILMS; FLIP CHIP; HEIGHT VARIATION; HIGH DENSITY; INPUT/OUTPUT; MECHANICAL CONNECTIONS; MICRO-BUMPS; SOLDER JOINT QUALITY; SOLDER JOINTS; SYSTEMATIC STUDY; THIN LAYERS; VOID FORMATION;

COPPER SMELTING; NICKEL METALLURGY;

TIN;

EID: 79960384773     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ECTC.2011.5898499     Document Type: Conference Paper

References (8)

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