Influence of the processing method on the amount and development of voids in miniaturized interconnections

Electronics System Integration Technology Conference, ESTC 2010 - Proceedings

Volumn , Issue , 2010, Pages

  Dimcic, Biljana ^a,b   Labie, Riet ^a   Zhang, Wenqi ^a   De Wolf, Ingrid ^a,b   Verlinden, Bert ^b  

^a IMEC   (Belgium)

^b UNIVERSITY OF LEUVEN   (Belgium)

Author keywords

[No Author keywords available]

Indexed keywords

BLANKET FILMS; BONDED BUMPS; CLEANING AGENTS; DOWN-SCALING; ELECTRONIC DEVICE; FLIP CHIP BUMPS; MECHANICAL BEHAVIOR; MICRO-STRUCTURAL; PACKAGE INTERCONNECTS; PROCESSING METHOD; TRANSIENT LIQUID PHASE;

CLEANING; COPPER; DIES; FLIP CHIP DEVICES; INTERMETALLICS; TIN ALLOYS;

TIN;

EID: 78651331677     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ESTC.2010.5642922     Document Type: Conference Paper

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