Modified imprinting process using hollow microneedle array for forming through holes in polymers

Microelectronic Engineering

Volumn 88, Issue 8, 2011, Pages 2121-2125

  Shibata, Takayuki ^a   Yukizono, Satoshi ^a   Kawashima, Takahiro ^a   Nagai, Moeto ^a   Kubota, Toshio ^b   Mita, Mamoru ^c  

^a TOYOHASHI UNIVERSITY OF TECHNOLOGY   (Japan)

^b IBARAKI UNIVERSITY   (Japan)

^c MEPJ Co Ltd   (Japan)

Author keywords

Flexible printed circuit (FPC) boards; High density interconnects (HDI); Hollow microneedle array; Micro hole processing; Microelectromechanical systems (MEMS); Polymer through holes; Thermal imprinting process

Indexed keywords

FLEXIBLE PRINTED CIRCUIT; HIGH-DENSITY INTERCONNECTS (HDI); IMPRINTING PROCESS; MICRO HOLES; MICROELECTROMECHANICAL SYSTEMS (MEMS); MICRONEEDLE ARRAYS;

MEMS; MICROELECTROMECHANICAL DEVICES; PLASTIC FILMS; POLYIMIDES; POLYMERIC FILMS; PRINTED CIRCUIT BOARDS; SILICA; SILICON COMPOUNDS; SILICON OXIDES; VEHICULAR TUNNELS;

NEEDLES;

EID: 79960061902     PISSN: 01679317     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.mee.2010.12.048     Document Type: Conference Paper

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