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Volumn , Issue , 2011, Pages

A first study on self-healing solid-state drives

Author keywords

[No Author keywords available]

Indexed keywords

DATA STORAGE; DESIGN STRATEGIES; DEVICE MODELING; INTERFACE TRAPS; MEMORY CELL; NAND FLASH MEMORY; SELF-HEALING; SYSTEM LEVELS; THERMAL MODELING;

EID: 79960012990     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/IMW.2011.5873201     Document Type: Article
Times cited : (17)

References (7)
  • 1
    • 2342522065 scopus 로고    scopus 로고
    • Effects of interface trap generation and annihilation on the data retention characteristics of flash memory cells
    • March
    • J.D. Lee, J.H. Choi, D. Park, and K. Kim, "Effects of interface trap generation and annihilation on the data retention characteristics of flash memory cells," IEEE Transactions on Device and Materials Reliability, vol. 4, pp. 110 - 117, March 2004.
    • (2004) IEEE Transactions on Device and Materials Reliability , vol.4 , pp. 110-117
    • Lee, J.D.1    Choi, J.H.2    Park, D.3    Kim, K.4
  • 6
    • 77957898678 scopus 로고    scopus 로고
    • Using data post-compensation and pre-distortion to tolerate cell-to-cell interference in MLC NAND flash memory
    • G. Dong, S. Li, and T. Zhang, "Using data post-compensation and pre-distortion to tolerate cell-to-cell interference in MLC NAND flash memory," IEEE Trans. on Circuits and Systems-I: Regular Papers, vol. 57, no. 10, pp. 2718-2728, 2010.
    • (2010) IEEE Trans. on Circuits and Systems-I: Regular Papers , vol.57 , Issue.10 , pp. 2718-2728
    • Dong, G.1    Li, S.2    Zhang, T.3
  • 7
    • 79959961397 scopus 로고    scopus 로고
    • The impact of lead-free reflow temperatures on the moisture sensitivity performance of plastic surface mount packages
    • Oct.
    • B.T. Vaccaro, R.L. Shook, and D.L. Gerlach, "The impact of Lead-Free reflow temperatures on the moisture sensitivity performance of plastic surface mount packages," in International Workshop on Thermal Investigations of ICs and Systems, Oct. 2009, pp. 113-116.
    • (2009) International Workshop on Thermal Investigations of ICs and Systems , pp. 113-116
    • Vaccaro, B.T.1    Shook, R.L.2    Gerlach, D.L.3


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.