Preparation and characterization of copper patterns on polyethylenimine- modified flexible substrates

Reactive and Functional Polymers

Volumn 71, Issue 9, 2011, Pages 943-947

  Su, Wei ^a   Li, Peiyuan ^b   Yang, Fang ^a   Liang, Lifang ^a   Huo, Lini ^b   Tang, Hui ^a  

^a GUANGXI TEACHERS EDUCATION UNIVERSITY   (China)

^b GUANGXI UNIVERSITY OF CHINESE MEDICINE   (China)

Author keywords

Copper pattern; Palladium; Polyethylenimine; Polymeric substrate; Surface modification

Indexed keywords

ADHESIVE INTERLAYERS; AFM; ATR FTIR; COPPER FILMS; COPPER PATTERN; CROSSLINKED; FACILE FABRICATION; FLEXIBLE POLYMERIC SUBSTRATES; FLEXIBLE POLYMERS; FLEXIBLE SUBSTRATE; MINIMUM FEATURE SIZES; PD CATALYST; POLYETHYLENIMINES; POLYMERIC SUBSTRATE; SELECTIVE DEPOSITION; XRD , TEM;

CATALYSTS; CONTACT ANGLE; COPPER; ELECTROLESS PLATING; ELECTRONICS INDUSTRY; FABRICATION; METALLIC FILMS; POLYMERIC FILMS;

SUBSTRATES;

EID: 79960005824     PISSN: 13815148     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.reactfunctpolym.2011.06.003     Document Type: Article

References (30)

1. S. Sawada, Y. Masuda, P. Zhu, and K. Koumoto Langmuir 22 2006 332
2. S. Qi, Z. Wu, D. Wu, W. Wang, and R. Jin Chem. Mater. 19 2007 393
3. K. Akamatsu, S. Ikeda, H. Nawafune, and H. Yanagimoto J. Am. Chem. Soc. 126 2004 10822
4. M. Mas-Torrent, and C. Rovira Chem. Soc. Rev. 37 2008 827
5. P. Yang, M. Yang, S. Zou, J. Xie, and W. Yang J. Am. Chem. Soc. 129 2007 1541
6. K. Akamatsu, A. Kimura, H. Matsubara, S. Ikeda, and H. Nawafune Langmuir 21 2005 8099
7. J. Rickerby, and J.H.G. Steinke Chem. Rev. 102 2002 1525
8. J.R. Lancaster, J. Jehani, G.T. Carroll, Y. Chen, N.J. Turro, and J.T. Koberstein Chem. Mater. 20 2008 6583
9. D. Zabetakis, and W.J. Dressick ACS Appl. Mater. Interfaces 1 2009 4
10. Z.J. Yu, E.T. Kang, and K.G. Neoh Polymer 43 2002 4137
11. T.J. Bradley, W.C.E. Schofield, R.P. Garrod, and J.P.S. Badyal Langmuir 22 2006 7552
12. A. Hozumi, S. Asakura, A. Fuwa, N. Shirahata, and T. Kameyama Langmuir 21 2005 8234
13. M. Kimura, H. Yamagiwa, D. Asakawa, M. Noguchi, T. Kurashina, T. Fukawa, and H. Shirai ACS Appl. Mater. Interfaces 2 2010 3714
14. Y. Zhang, H. Peng, W. Huang, Y. Zhou, X. Zhang, and D. Yan J. Phys. Chem. C 112 2008 2330
15. K. Zhan, H. You, W. Liu, J. Lu, P. Lu, and J. Dong React. Funct. Polym. 71 2011 756
16. B. Ochiai, and Y. Shimada React. Funct. Polym. 71 2011 791
17. P. Li, B. Ge, S. Zhang, S. Chen, Q. Zhang, and Y. Zhao Langmuir 24 2008 6567
18. H. Kim, and M.W. Urban Langmuir 14 1998 7235
19. A. Schallon, V. Jérôme, A. Walther, C.V. Synatschke, A.H.E. Müller, and R. Freitag React. Funct. Polym. 70 2010 1
20. H. Xu, R. Hong, X. Wang, R. Arvizo, C. You, B. Samanta, D. Patra, M.T. Tuominen, and V.M. Rotello Adv. Mater. 19 2007 1383
21. W. Su, P. Li, L. Yao, F. Yang, L. Liang, and J. Chen Chem. Phys. Chem 12 2011 1143
22. R.W. Snyder, B. Thomson, B. Bartges, D. Czerniawski, and P.C. Painter Macromolecules 22 1989 4166
23. S. Ikeda, K. Akamatsu, H. Nawafune, T. Nishino, and S. Deki J. Phys. Chem. B 108 2004 15599
24. X. Wang, V. Schwartz, J.C. Clark, X. Ma, S.H. Overbury, X. Xu, and C. Song J. Phys. Chem. C 113 2009 7260
25. Y.F. Yang, L.S. Wan, and Z.K. Xu J. Membr. Sci. 337 2009 70
26. Z.J. Yu, E.T. Kang, and K.G. Neoh Langmuir 18 2002 10221
27. S. Kidambi, J. Dai, J. Li, and M.L. Bruening J. Am. Chem. Soc. 126 2004 2658
28. S. Kidambi, and M.L. Bruening Chem. Mater. 17 2005 301
29. M.S. Miller, H.L. Filiatrault, G.J.E. Davidson, M. Luo, and T.B. Carmichael J. Am. Chem. Soc. 132 2010 765
30. Y. Lu Appl. Surf. Sci. 255 2009 8430