Investigation of hygroscopic properties in electronic packages using molecular dynamics simulation

Polymer

Volumn 52, Issue 15, 2011, Pages 3437-3442

  Chang, Seung Hwan ^a   Kim, Hak Sung ^b  

^a Chung Ang University   (South Korea)

^b Hanyang University   (South Korea)

Author keywords

Hygroscopic characteristic; Molecular dynamics; Swelling

Indexed keywords

ELECTRONICS PACKAGING; FAILURE (MECHANICAL); MOISTURE; PACKAGING MATERIALS; SEMICONDUCTOR DEVICE MANUFACTURE; SOLDERING; SWELLING;

ELECTRONIC PACKAGING; HYGROSCOPIC CHARACTERISTIC; HYGROSCOPIC MATERIALS; HYGROSCOPIC PROPERTIES; INTERFACIAL DELAMINATION; MOISTURE CONCENTRATION; MOLECULAR DYNAMICS SIMULATIONS; SEMICONDUCTOR INDUSTRY;

MOLECULAR DYNAMICS;

EID: 79959826988     PISSN: 00323861     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.polymer.2011.05.056     Document Type: Article

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