The effect of Ti sputter target oxidation level on reactive High Power Impulse Magnetron Sputtering process behaviour

Surface and Coatings Technology

Volumn 205, Issue SUPPL. 2, 2011, Pages

  Audronis, Martynas ^a   Bellido Gonzalez, Victor ^a  

^a Gencoa Ltd   (United Kingdom)

Author keywords

High Power Impulse Magnetron Sputtering; Hysteresis; Reactive sputtering; Target oxidation

Indexed keywords

CLEAN METAL; DC SPUTTERING; HIGH POWER IMPULSE MAGNETRON SPUTTERING; HIGH-POWER; HYSTERESIS BEHAVIOUR; MAGNETRON SPUTTERING PROCESS; METAL SURFACES; OXIDATION LEVEL; PEAK VOLTAGE; PROCESSING PARAMETERS; PULSE FREQUENCIES; REACTIVE DEPOSITION; REACTIVE PROCESS; SPUTTER CLEANING; TARGET STATE; TARGET SURFACE;

DC POWER TRANSMISSION; ELECTRIC POTENTIAL; HYSTERESIS; MAGNETRON SPUTTERING; TRANSITION METALS;

OXIDATION;

EID: 79959807011     PISSN: 02578972     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.surfcoat.2011.02.056     Document Type: Article

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