Fast flexible electronics based on printable thin mono-crystalline silicon

ECS Transactions

Volumn 34, Issue 1, 2011, Pages 137-142

  Ma, Zhenqiang ^a   Zhang, Kan ^a   Seo, Jung Hun ^a   Zhou, Han ^a   Sun, Lei ^a   Yuan, Hao Chih ^a   Qin, Guoxuan ^a   Pang, Huiqing ^a   Zhou, Weidong ^b  

^a Wisconsin Electric Machines and Power Electronics Consortium   (United States)

^b University of Texas at Arlington   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ACCESS RESISTANCE; ACTIVE MATERIAL; AMORPHOUS SI; BULK COUNTERPART; BURIED OXIDE LAYERS; DEVICE SPEED; DEVICE STRUCTURES; FABRICATION PROCESS; FEATURE SIZES; HIGH TEMPERATURE PROCESS; HIGH-QUALITY MATERIALS; MECHANICAL FLEXIBILITY; MOBILITY VALUE; MONOCRYSTALLINE; ORGANIC MATERIALS; PLASTIC SUBSTRATES; RADIO FREQUENCIES; SILICON ON INSULATOR; STRAINED CHANNELS;

AMORPHOUS MATERIALS; AMORPHOUS SILICON; CARRIER MOBILITY; MONOCRYSTALLINE SILICON; SEMICONDUCTING SILICON; SEMICONDUCTOR DEVICE MANUFACTURE; SEMICONDUCTOR DOPING; THIN FILM TRANSISTORS; TRANSISTORS;

FLEXIBLE ELECTRONICS;

EID: 79959675566     PISSN: 19385862     EISSN: 19386737     Source Type: Conference Proceeding    
DOI: 10.1149/1.3567572     Document Type: Conference Paper

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