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Volumn 28, Issue 20, 2010, Pages 79-90
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Development, optimization and evaluation of a CF4 pre-treatment process to remove unwanted interfacial layers in stacks of CVD and PECVD polycrystalline silicon-germanium for MEMS applications
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Author keywords
[No Author keywords available]
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Indexed keywords
CMOS INTEGRATED CIRCUITS;
DEPOSITION;
GERMANIUM OXIDES;
MEMS;
NANOCRYSTALLINE MATERIALS;
POLYCRYSTALLINE MATERIALS;
SI-GE ALLOYS;
SILICON COMPOUNDS;
DEPOSITION CHAMBERS;
INTERFACIAL LAYER;
MECHANICAL AND ELECTRICAL PROPERTIES;
MEMS APPLICATIONS;
MICRO ELECTRO MECHANICAL SYSTEM;
POLY-CRYSTALLINE SILICON;
POLYCRYSTALLINE SILICON GERMANIUMS;
PRETREATMENT PROCESS;
SILICON WAFERS;
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EID: 79959503612
PISSN: 19385862
EISSN: 19386737
Source Type: Conference Proceeding
DOI: 10.1149/1.3489934 Document Type: Conference Paper |
Times cited : (11)
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References (7)
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