-
2
-
-
76349113557
-
A study of through-silicon-via impact on the 3D Stacked IC Layout
-
Nov.
-
D. H. Kim, K. Athikulwongse, and S. K. Lim, A Study of Through-Silicon-Via Impact on the 3D Stacked IC Layout," in Proc. IEEE Int. Conf. on Computer-Aided Design, Nov. 2009, pp. 674-680.
-
(2009)
Proc. IEEE Int. Conf. on Computer-Aided Design
, pp. 674-680
-
-
Kim, D.H.1
Athikulwongse, K.2
Lim, S.K.3
-
4
-
-
77950935728
-
Modeling and analysis of coupling between tsvs, metal, and rdl interconnects in TSV-based 3D IC with silicon interposer
-
K. Yoon, G. Kim, W. Lee, T. Song, J. Lee, H. Lee, K. Park, and J. Kim, Modeling and Analysis of Coupling between TSVs, Metal, and RDL interconnects in TSV-based 3D IC with Silicon Interposer in Electronics Packaging Technology Conference, 2009, pp. 702-706.
-
(2009)
Electronics Packaging Technology Conference
, pp. 702-706
-
-
Yoon, K.1
Kim, G.2
Lee, W.3
Song, T.4
Lee, J.5
Lee, H.6
Park, K.7
Kim, J.8
-
5
-
-
70549084864
-
Compact modelling of through-silicon vias (TSVs) in three-dimensional (3-D) integrated circuits
-
R. Weerasekera, M. Grange, D. Pamunuwa, H. Tenhunen, and L. -R. Zheng, Compact Modelling of Through-Silicon Vias (TSVs) in Three-Dimensional (3-D) Integrated Circuits," in IEEE International 3 D System Integration Conf., 2009, pp. 1-8.
-
(2009)
IEEE International 3 D System Integration Conf.
, pp. 1-8
-
-
Weerasekera, R.1
Grange, M.2
Pamunuwa, D.3
Tenhunen, H.4
Zheng, L.-R.5
-
6
-
-
69549108427
-
Closed-form expressions of 3-D via resistance, inductance, and capacitance
-
I. Savidis and E. G. Friedman, Closed-Form Expressions of 3-D Via Resistance, Inductance, and Capacitance," in IEEE Trans. on Electron Devices, 2009, pp. 1873-1881.
-
(2009)
IEEE Trans. on Electron Devices
, pp. 1873-1881
-
-
Savidis, I.1
Friedman, E.G.2
-
8
-
-
74549172091
-
Active circuit to through silicon via (TSV) noise coupling
-
J. Cho, J. Shim, E. Song, J. S. Pak, J. Lee, H. Lee, K. Park, and J. Kim, "Active Circuit to Through Silicon Via (TSV) Noise Coupling," in Proc. IEEE Electrical Performance of Electronic Packaging, 2007, pp. 97-100.
-
(2007)
Proc. IEEE Electrical Performance of Electronic Packaging
, pp. 97-100
-
-
Cho, J.1
Shim, J.2
Song, E.3
Pak, J.S.4
Lee, J.5
Lee, H.6
Park, K.7
Kim, J.8
-
9
-
-
70549084860
-
Through-slicon via (TSV)-induced noise characterization and noise mitigation using coaxial TSVs
-
N. H. Khan, S. M. Alam, and S. Hassoun, Through-Slicon Via (TSV)-induced Noise Characterization and Noise Mitigation using Coaxial TSVs in IEEE International 3D System Integration Conf., 2009, pp. 1-7.
-
(2009)
IEEE International 3D System Integration Conf.
, pp. 1-7
-
-
Khan, N.H.1
Alam, S.M.2
Hassoun, S.3
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