SCOPUS 정보 검색 플랫폼

Volumn 109, Issue 10, 2011, Pages

In situ electro-mechanical experiments and mechanics modeling of tensile cracking in indium tin oxide thin films on polyimide substrates

(5) Peng, Cheng a Jia, Zheng b Bianculli, Dan a Li, Teng b Lou, Jun a

a Rice University (United States)

b UNIVERSITY OF MARYLAND (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CRACK DENSITY; CRACK INITIATION AND PROPAGATION; ELECTRICAL RESISTANCES; ELECTRICAL TESTS; ELECTRO-MECHANICAL; FLEXIBLE DEVICE; IN-SITU; INDIUM TIN OXIDE THIN FILMS; INTERFACIAL TOUGHNESS; ITO FILMS; ITO THIN FILMS; LARGE DEFORMATIONS; MATERIAL SYSTEMS; MECHANICS MODELING; MECHANICS MODELS; POLYIMIDE SUBSTRATE; POLYMER SUBSTRATE; RELIABLE OPERATION; SCANNING ELECTRON MICROSCOPE; TENSILE CRACKING; THICKNESS DEPENDENCE; TRANSPARENT ELECTRODE;

CRACKS; FLEXIBLE ELECTRONICS; FRACTURE TOUGHNESS; INDIUM; INDIUM COMPOUNDS; MATERIALS PROPERTIES; MECHANICS; POLYIMIDES; POLYMER FILMS; SCANNING ELECTRON MICROSCOPY; TENSILE STRAIN; THIN FILMS; TIN; TIN OXIDES;

OXIDE FILMS;

EID: 79958836524 PISSN: 00218979 EISSN: None Source Type: Journal
DOI: 10.1063/1.3592341 Document Type: Conference Paper

Times cited : (72)

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