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Volumn 22, Issue 6, 2011, Pages 592-595

The microstructure and properties of the Sn-xBi-0.9Zn-0.3Ag lead-free solders

Author keywords

[No Author keywords available]

Indexed keywords

LEAD FREE SOLDERS; MICROSTRUCTURE AND PROPERTIES; WEIGHT PERCENT;

INTERMETALLICS; MICROSTRUCTURE; SILVER; SILVER ALLOYS; SOLDERING ALLOYS; ZINC;

TIN;

EID: 79958792680 PISSN: 09574522 EISSN: 1573482X Source Type: Journal
DOI: 10.1007/s10854-010-0182-z Document Type: Article

Times cited : (7)

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