Single-chamber filament-assisted chemical vapor deposition of polymer and organosilicate films for air gap interconnect formation

Thin Solid Films

Volumn 519, Issue 14, 2011, Pages 4571-4573

  Lee, Eric ^a   Faguet, Jacques ^b   Brcka, Jozef ^b   Akiyama, Osayuki ^b   Liu, Junjun ^a   Toma, Dorel ^a  

^a US Technology Development Center   (United States)

^b US Technology Development Center   (United States)

Author keywords

Air gap; FACVD; Interconnect; Low k

Indexed keywords

AIR GAP INTEGRATION; AIR-GAPS; EFFECTIVE DIELECTRIC CONSTANTS; FACVD; INTERCONNECT; LOW-K; ONE-STEP METHODS; ORGANOSILICATE FILMS; POLYMER ADHESION; SINGLE DAMASCENE STRUCTURES; SOLUTION CHEMISTRY; ULTRA LOW-K; VAPOR PHASE;

CHEMICAL VAPOR DEPOSITION; DIELECTRIC MATERIALS; POLYMERS; TEMPERATURE CONTROL;

POLYMER FILMS;

EID: 79958792129     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.tsf.2011.01.312     Document Type: Conference Paper

References (9)

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