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Volumn 7593, Issue , 2010, Pages

Effect of surface treatments/coatings and soft bake profile on surface uniformity and adhesion of SU-8 on a glass substrate

Author keywords

[No Author keywords available]

Indexed keywords

GLASS SUBSTRATES; INSTRON; METAL LAYER; PROCESS PARAMETERS; SEED LAYER; SOFT BAKE; SOFT BAKE TEMPERATURE; STRESS TESTING; SURFACE UNIFORMITY;

EID: 79958101360     PISSN: 16057422     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.842957     Document Type: Conference Paper
Times cited : (4)

References (14)
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  • 6
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    • Study of stress and adhesion strength in SU-8 resist layers on silicon substrate with different seed layers
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    • DOI 10.1007/s00542-005-0587-4
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  • 8
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    • The effect of soft bake temperature on the polymerization of SU-8 photoresist
    • Anhoj, T A, Jorgensen, A M, Zauner, D A and Hubner, J; "The effect of soft bake temperature on the polymerization of SU-8 photoresist", J. Micromech. Microeng. 16 (2006):1819-1824.
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    • Barber, R.L.1
  • 10
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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.