Study of stress and adhesion strength in SU-8 resist layers on silicon substrate with different seed layers

Journal of Micro/Nanolithography, MEMS, and MOEMS

Volumn 6, Issue 3, 2007, Pages

  Barber, Richard L ^a   Ghantasala, Muralidhar K ^b   Divan, Ralu ^c   Mancini, Derrick C ^c   Harvey, Erol C ^a  

^a SWINBURNE UNIVERSITY OF TECHNOLOGY   (Australia)

^b Parkview Campus   (United States)

^c ARGONNE NATIONAL LABORATORY   (United States)

Author keywords

Adhesion strength; Deep x ray lithography (DXRL); Internal stresses; Seed layers; SU 8

Indexed keywords

CHROMIUM COMPOUNDS; LITHOGRAPHY; SEED; SILICON; TITANIUM COMPOUNDS;

DEEP X-RAY LITHOGRAPHY (DXRL); SEED LAYERS;

STRESS ANALYSIS;

EID: 40049096453     PISSN: 19325150     EISSN: 19325134     Source Type: Journal    
DOI: 10.1117/1.2778644     Document Type: Article

References (35)