LTCC package for high temperature applications

Microelectronics Reliability

Volumn 51, Issue 7, 2011, Pages 1241-1244

  Nowak, Damian ^a   Dziedzic, Andrzej ^a  

^a WROCLAW UNIVERSITY OF TECHNOLOGY   (Poland)

Author keywords

[No Author keywords available]

Indexed keywords

AEROSPACE FIELD; ELECTRICAL CONNECTION; ELECTRICAL PARAMETER; ELECTRONIC DEVICE; GEOTHERMAL INDUSTRY; GROWING DEMAND; HARSH ENVIRONMENT; HIGH TEMPERATURE; HYDROGEN SENSOR; INTEGRATED HEATER; INTEGRATED PASSIVE COMPONENTS; LOW-TEMPERATURE CO-FIRED CERAMICS; LTCC TECHNOLOGY; MANUFACTURING PROCESS; MECHANICAL DAMAGES; MULTILAYER STRUCTURES; OPTICAL CONNECTION; PACKAGE STRUCTURE; PACKAGING ISSUES; PACKAGING SYSTEM; PACKAGING TECHNOLOGIES; PROCESS DEVELOPMENT; SENSORS AND ACTUATORS; TEMPERATURE REGULATIONS; THICK-FILM TECHNOLOGY;

AUTOMOBILE ELECTRONIC EQUIPMENT; DISTRIBUTED PARAMETER CONTROL SYSTEMS; ELECTRIC CONNECTORS; GEOTHERMAL FIELDS; HIGH TEMPERATURE APPLICATIONS; PACKAGING MATERIALS; PETROLEUM INDUSTRY; PROCESS CONTROL; PROCESS MONITORING; SENSORS; SILICON CARBIDE; THERMODYNAMIC PROPERTIES;

PACKAGING;

EID: 79958081048     PISSN: 00262714     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.microrel.2011.02.018     Document Type: Conference Paper

References (14)

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