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Volumn 39, Issue 4, 2009, Pages 701-704

High temperature LTCC package for SiC-based gas sensor

Author keywords

Low temperature co fired ceramics (LTCC); Packaging; Thick film

Indexed keywords

ELECTRICAL PARAMETER; ELECTRICAL SIGNAL; ELECTRONIC DEVICE; GAS SENSORS; HIGH TEMPERATURE; HYDROGEN GAS SENSORS; INTEGRATED HEATER; LOW TEMPERATURE CO-FIRED CERAMICS (LTCC); LOW-TEMPERATURE CO-FIRED CERAMICS; LTCC TECHNOLOGY; MECHANICAL DAMAGES; MULTILAYER STRUCTURES; OPTICAL SIGNALS; PACKAGE STRUCTURE; PACKAGING ISSUES; PACKAGING SYSTEM; PASSIVE COMPONENTS; SEMICONDUCTOR MICROELECTRONICS; THERMAL PROPERTIES; THICK-FILM TECHNOLOGY;

EID: 77449096564     PISSN: 00785466     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article
Times cited : (13)

References (8)
  • 7
    • 45849103508 scopus 로고    scopus 로고
    • Microchannel fabrication process in LTCC ceramics
    • MALECHA K., GOLONKA L.J., Microchannel fabrication process in LTCC ceramics, Microelectronics Reliability 48(6), 2008, pp. 866-871.
    • (2008) Microelectronics Reliability , vol.48 , Issue.6 , pp. 866-871
    • Malecha, K.1    Golonka, L.J.2


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.