How advanced low coefficient of thermal expansion (CTE) laminates and prepregs can improve the reliability of printed circuit boards (PCBs)

Circuit World

Volumn 29, Issue 1, 2002, Pages

  Weinhold, Michael ^a   Yen, George ^b  

^a Du Pont de Nemours International SA   (Switzerland)

^b DuPont ^*  (Taiwan)

Author keywords

Laminated structures; Printed circuit boards

Indexed keywords

LAMINATES; LIFE CYCLE; PERMITTIVITY; RELIABILITY; SOLDERING; STRESSES; THERMAL EXPANSION;

PREPREGS;

PRINTED CIRCUIT BOARDS;

EID: 18644367640     PISSN: 03056120     EISSN: None     Source Type: Journal    
DOI: 10.1108/03056120310445907     Document Type: Article

References (0)