Pulverization characteristics and pulverizing of waste printed circuit boards (printed wiring boards) based on resource utilization

Shanghai Jiaotong Daxue Xuebao/Journal of Shanghai Jiaotong University

Volumn 41, Issue 4, 2007, Pages 551-556

  Lu, Hong Zhou ^a   Li, Jia ^a   Guo, Jie ^a   Xu, Zhen Ming ^a  

^a SHANGHAI JIAO TONG UNIVERSITY   (China)

Author keywords

Printed circuit boards; Pulverization; Pulverization mechanism; Reclamation

Indexed keywords

COMMINUTION; PARTICLE SIZE ANALYSIS; RECLAMATION; WASTE UTILIZATION;

PULVERIZATION MECHANISM;

PRINTED CIRCUIT BOARDS;

EID: 34249857544     PISSN: 10062467     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (9)

1. Quinet P, Proost J, Lierde A V. Recovery of precious metals from electronic scrap by hydrornetallurgical processing routes[J]. Minerals and Metallurgical Processing, 2005, 22(1): 17-22.
2. Blazso M, Czegeny Z, Csoma C. Pyrolysis and debromination of flame retarded polymers of electronic scrap studied by analytical pyrolysis[J]. Journal of Analytical and Applied Pyrolysis, 2002, 64(2): 249-261.
3. ZHOU Cui-hong, Maixi L. Study on major components and liberation characteristics of discarded printed circuit board[J]. Techniques and Equipment for Environmental Pollution Control, 2005, 6(4): 28-31.
4. YE Cui-ling, ZHANG Jin-xia, WAN Lin-juan, et al. Preliminary analysis of break and classification of electronic waste[J]. Jiangsu Environmental Science and Technology, 2005, 17(6): 43-45.
5. GU Guo-hua, QI Yun-feng. Crushing performance and resource characteristic of printed circuit board scrap[J]. The Chinese Journal of Nonferrous Metal, 2004, 14(6): 1037-1041.
6. Higashiyama Y, Asano K. Recent progress in electrostatic separation technology[J]. Particul Sci Technol, 1998, 16: 77-90.
7. Yokoyama S, Iji M. Recycling of thermosetting plastic waste from electronic component production processes[C]//Proceeding of 1995 IEEE International Symposium. Orlando, FL, USA: Electronics and Environment, 1995: 132-137.
8. Shunli Z H, Eric F. Intelligent Liberation and classification of electronic scrap[J]. Powder Technology, 1999, 105: 295-301.