Thermal properties of silicon nitride beams below one kelvin

IEEE Transactions on Applied Superconductivity

Volumn 21, Issue 3 PART 1, 2011, Pages 232-235

  Wang, G ^a   Yefremenko, V ^a   Novosad, V ^a   Datesman, A ^a   Pearson, J ^a   Divan, R ^a   Chang, C L ^b   Bleem, L ^b   Crites, A T ^b   Mehl, J ^b   Natoli, T ^b   McMahon, J ^c   Sayre, J ^d   Ruhl, J ^d   Meyer, S S ^b   Carlstrom, J E ^b  

^a ARGONNE NATIONAL LABORATORY   (United States)

^b UNIVERSITY OF CHICAGO   (United States)

^c UNIVERSITY OF MICHIGAN   (United States)

^d CASE WESTERN RESERVE UNIVERSITY   (United States)

Author keywords

Heat transport; Phonons; Superconducting transition edge sensor; Thermal conductivity

Indexed keywords

HEAT CAPACITIES; HEAT TRANSPORT; LATERAL DIMENSION; PHONON MEAN FREE PATH; PHONON TRANSPORT MODELS; SUPERCONDUCTING TRANSITION EDGE SENSORS; THERMAL CONDUCTANCE; THERMAL PROPERTIES;

PHONONS; SENSORS; SILICON NITRIDE; THERMODYNAMIC PROPERTIES;

THERMAL CONDUCTIVITY;

EID: 79957962067     PISSN: 10518223     EISSN: None     Source Type: Journal    
DOI: 10.1109/TASC.2010.2089407     Document Type: Conference Paper

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