A newly developed polishing pad for achieving high surface flatness without edge roll off

CIRP Annals - Manufacturing Technology

Volumn 60, Issue 1, 2011, Pages 371-374

  Enomoto, T ^a   Satake, U ^a   Miyake, T ^a   Tabata, N ^b  

^a OSAKA UNIVERSITY   (Japan)

^b TORAY INDUSTRIES INC   (Japan)

Author keywords

Flatness; Polishing; Semiconductor

Indexed keywords

EDGE ROLL OFFS; FLATNESS; GLASS DISKS; GLASS PLATE; POLISHING PADS; POLYMER LAYERS; SEMICONDUCTOR; STRESS DISTRIBUTION; SURFACE FLATNESS; THIN LAYERS; WORK PIECES;

FINITE ELEMENT METHOD; GLASS; SEMICONDUCTING SILICON COMPOUNDS; SILICON WAFERS; STRESS CONCENTRATION;

POLISHING;

EID: 79957644230     PISSN: 00078506     EISSN: 17260604     Source Type: Journal    
DOI: 10.1016/j.cirp.2011.03.125     Document Type: Article

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