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Volumn 38, Issue 1, 1999, Pages 38-39

A new method for the precise measurement of wafer roll off of silicon polished wafer

Author keywords

Block gauge; Capacitive gauging tool; Edge exclusion length; Polishing; Silicon wafer; STIR; Stylus profiler; Wafer roll off

Indexed keywords

CAPACITANCE MEASUREMENT; GAGES; POLISHING; SEMICONDUCTOR DEVICE MANUFACTURE; SURFACE MEASUREMENT;

EID: 0032647537     PISSN: 00214922     EISSN: None     Source Type: Journal    
DOI: 10.1143/JJAP.38.38     Document Type: Article
Times cited : (25)

References (5)
  • 3
    • 33645041733 scopus 로고    scopus 로고
    • Japan Patent 168964
    • N. Kimura and H. Yasuda: Japan Patent 168964 (1997).
    • (1997)
    • Kimura, N.1    Yasuda, H.2


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.