Analysis on lapping and polishing pressure distribution

CIRP Annals - Manufacturing Technology

Volumn 47, Issue 1, 1998, Pages

  Cai, G Q ^a   Lu, Y S ^a   Cai, R ^a   Zheng, H W ^a  

^a NORTHEASTERN UNIVERSITY   (China)

Author keywords

Lapping; Polishing; Pressure

Indexed keywords

BOUNDARY CONDITIONS; INTERFACES (MATERIALS); MATHEMATICAL MODELS; PRESSURE EFFECTS;

PRESSURE DISTRIBUTIONS;

LAPPING;

EID: 0031625409     PISSN: 00078506     EISSN: None     Source Type: Journal    
DOI: 10.1016/s0007-8506(07)62825-x     Document Type: Article

References (8)

1. Töenshoff, H. K, Schmieden, W. V., Inasaki, I., König, W. and Spur, G., 1990, Abrasive Machining of Silicon, , Annals of the CIRP, 39/2: 621-635
2. Komanduri, R., Lucca, D. A. and Tani, Y., 1997, Technological Advances in Fine Abrasive Processes, Annals of the CIRP, 46/2:
3. Kasai, T., Matumoto, F. and Kobayashi, A., 1988, Newly Developed Fully Automatic Polishing Machines for Obtainable Super-Smooth Surfaces of Compound Semi-conductor Wafers, Annals of the CIRP, 37/1: 537-540
4. Spur, G., Simpfendörfer, D., 1985, The Simulation of Plane Surface Lapping Kinematics, Proc. Of the XIII, North American Manufacturing Confer. Berkly/USA, 326-333
5. King J., 1986, Workpiece Materials Removal and Lapping Wheel Wear in Plane and Plane-Parallel Lapping, Annals of the CIRP, 35(1):219-222
6. Gecit, M. R., 1986, Axisymmetric Contact Problem for a Semi-infinite Cylinder and a Half Space, Int. J. Engng Sci., 24: 1245-1256
7. Shield, T. W. and Bogy, D. B., 1989, Multiple Region Contact Solutions for a Flat Indenter on a Layered Elastic Half Space: Plane-Strain Case, Trans, of the ASME, Journal of Applied Mechanics, 56: 251-262
8. Shield, T. W and Bogy, D. B., 1989, Some Axisymmetric Problems for Layered Media, Trans, of the ASME, Journal of Applied Mechanics,56: 798-813